Halo Industries develops proprietary laser-based wafering technology for silicon carbide (SiC) substrates, a critical material for semiconductor manufacturing. The company's process replaces traditional mechanical wire saw slicing with laser-controlled cutting, reducing material waste and improving yields in the production of SiC wafers used across automotive, power electronics, and data centre applications.
Founded in 2014 as a Stanford University spinout, Halo Industries has raised $132m in total funding, including an $80m Series B led by the US Innovative Technology Fund. The company's technology achieves 2.2–2.3 wafers per millimetre of material - substantially higher than conventional methods - while reducing kerf loss (material wasted during cutting) by approximately 90 per cent. These efficiency gains address a significant cost burden in substrate manufacturing, where current slicing processes generate billions of dollars in annual material waste.
Halo's substrate technology serves semiconductor manufacturers supplying electric vehicles, renewable energy systems, data centres, and industrial applications where SiC's thermal and electrical properties offer performance advantages. The company is currently scaling manufacturing operations to meet growing demand for advanced semiconductor substrates.
